Processing of heat dissipation sheets for cooling manufacturing equipment used in semiconductor production.
We will solve the thermal issues of manufacturing equipment with suitable heat dissipation sheet processing.
In semiconductor manufacturing equipment, the heat generation of components such as CPUs and GPUs has increased due to higher performance, making thermal management an important design challenge. Thermal interface materials (TIM) are used to fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or enclosure. Our company provides a one-stop solution, from selecting thermal interface materials based on heat generation, gaps, and usage environments, to shaping them according to the installation locations. We offer solutions for thermal challenges in various heat-generating areas, including CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power supplies, and circuit boards/enclosures. [Use Cases] - Cooling of heat-generating components (such as CPUs and GPUs) within semiconductor manufacturing equipment - Temperature management of precision devices - Stable operation and longevity of equipment [Benefits of Implementation] - Suppression of temperature rise in heat-generating components - Maintenance and improvement of equipment performance - Reduction of failure risks
- Company：五輪パッキング
- Price：Other
